Numerical analysis of temperature elevation in the head due to power dissipation in a cortical implant

scientific article published in January 2008

Numerical analysis of temperature elevation in the head due to power dissipation in a cortical implant is …
instance of (P31):
scholarly articleQ13442814

External links are
P356DOI10.1109/IEMBS.2008.4649312
P698PubMed publication ID19162815

P2093author name stringCatherine Dehollain
Kanber Mithat Silay
Michel Declercq
P407language of work or nameEnglishQ1860
P921main subjectnumerical analysisQ11216
P304page(s)951-956
P577publication date2008-01-01
P1433published inAnnual International Conference of the IEEE Engineering in Medicine and Biology SocietyQ26839968
P1476titleNumerical analysis of temperature elevation in the head due to power dissipation in a cortical implant
P478volume2008

Reverse relations

Q30356760Implications for a Wireless, External Device System to Study Electrocorticographycites workP2860

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