scholarly article | Q13442814 |
P50 | author | Seungjun Noh | Q60967342 |
P2093 | author name string | Hao Zhang | |
Katsuaki Suganuma | |||
P2860 | cites work | Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications | Q35640547 |
P275 | copyright license | Creative Commons Attribution 4.0 International | Q20007257 |
P6216 | copyright status | copyrighted | Q50423863 |
P433 | issue | 12 | |
P407 | language of work or name | English | Q1860 |
P921 | main subject | semiconductor | Q11456 |
P304 | page(s) | 2531 | |
P577 | publication date | 2018-12-12 | |
P1433 | published in | Materials | Q6786584 |
P1476 | title | Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors | |
P478 | volume | 11 |
Search more.