Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors

Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors is …
instance of (P31):
scholarly articleQ13442814

External links are
P356DOI10.3390/MA11122531
P932PMC publication ID6317002
P698PubMed publication ID30545143

P50authorSeungjun NohQ60967342
P2093author name stringHao Zhang
Katsuaki Suganuma
P2860cites workJoining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and ApplicationsQ35640547
P275copyright licenseCreative Commons Attribution 4.0 InternationalQ20007257
P6216copyright statuscopyrightedQ50423863
P433issue12
P407language of work or nameEnglishQ1860
P921main subjectsemiconductorQ11456
P304page(s)2531
P577publication date2018-12-12
P1433published inMaterialsQ6786584
P1476titleHeat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
P478volume11

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